Soldering compound.



FRIEDRICH PIOII, OF BERLIN, GERMANY.

soLoE RiNe COMPOUND.

SPECIFICATION forming part of Letters Patent No. 647,632, dated April17, 1900.

Original application filed March 21, 1898, Serial No. 674,697, Dividedand this application filed August 11,1899. Serial No. 726,915. (Nospecimens.)

To all whom it may concern.-

Be it known that I, FRIEDRICH PICH, a subject of the Emperor of Germany,and a resident of Berlin, Germany, have invented certain new and usefulImprovements in Solder ing Compounds, (for which I have filedapplications as follows: in Austria February 23, 1898; in HungaryFebruary 26, 1898; in Belgium February 28, 1898; in France February 23,1898; in Great Britain February 23, 1898; in Denmark February 23, 1898;in Norway February 26, 1898; in Sweden March 1, 1898; in Italy March 6,1898; in Luxemburg February 22, 1898; in Spain March 17, 1898; in RussiaApril 9, 1898, and in Germany December 6, 1897,) of which the followingis a specification.

The object of my invention is to provide a new and improved solderingcompound, by the use of which compound, in connection with a suitablesolder, cast-iron and other substances which have heretofore only withdifficulty been hard-soldered together may be quickly, easily, andcheaply brazed or hardsoldered together as completely and solidly ascopper, brass, and like metals havinga greater affinity for solder thaniron may be by the ordinary methods of brazing or hardsoldering.

To form my improved soldering compound, I boil togetherfinely-pulverized borax and finely-pulverized suboxid of copper, so thatthe same are intimately mixed and so that each particle of the suboxidof copper is surrounded, covered, and protected from the atmosphere by athin film of the borax. Any desired proportions of the two may be used;but usuallyl take one-half of each, mixed with sufficient water todissolve the same thoroughly by the boiling and to cool down into a sortof paste.

While I prefer to use the suboxid of copper, any other suitable form offinely-pulverized copper or the oxid or other form of any metal having agreater affinity for solder than iron .may, if desired, be used, and inlike manner in place of the borax other suitable fluxes,

such as glass or water-glass, may be used; but I have found the bestresults to arise from the use of suboxid of copper and borax mixed intoa paste by boiling the same together in water, although they may bemixed together protects the suboxid of copper against the action of theoxygen of the atmosphere. Consequently the suboxid of copper, likewiseheated to a red heat, transfers its oxygen to the red hot cast-ironsurface,which oxygen combines with the graphite contained in thecast-iron surfaces to form carbon monoxid or dioxid, thus decarbonizingsaid surfaces, while the metallic copper becomes dissociatedin a veryfinely-divided condition. At the same time the hard-solder is added, andas this S01d01,Wl1lQil is brought upon the surfaces to be soldered inthe well-known manner, is likewise melted by the heat it alloys itselfwith the incandescent particles of copper, and this new a1- loyimmediately combines with the red-hot decarbonized soldering-surfaces ofthe castlIOll.

To the paste heretofore described finelypowered decarbonized iron may beadded with good results in time and uniformity of union throughout theentire joint,'and good results may be also obtained by substitutingsuboxid of iron alone or mixed with the suboxid of copper for the puresuboxid of copper.

I do not claim herein the process of hardsoldering cast-iron hereindescribed, as I have specifically claimed such process in a separateapplication for Letters Patent thereon, that and this application beingdivisional applications of an original application filed by me March 21,1898, Serial No. 674,697.

I do not intendto limit myself strictly to a soldering compound formedof the exact ingredients herein described, nor to the exact process offorming such compound herein set forth, as I consider that any compoundcontaining any finely-comminuted form of copper which may be'depositedon the iron as metallic copper by the action of heat or any compoundconsisting of a suitable flux forminga film around each particle of anyfinelycomminuted metal which in its metallic state has a great affinityfor solder and may be merged with iron or like metals and depositedthereon in a metallic state is within the scope of my invention.

What I claim is' 1. A soldering compound containing borax and atriturated mixture of finely-comminuted oxid of iron and oxid of copper,substan= tially as described.

2. A soldering compound containing a me= tallic oxid or mixture of oxidsin a finelycomminuted form, and a suitable fiuxing material mingled andmixed therewith in such manner that a film of the fluxing materialsurrounds and protects from the air each particle of oxid, substantiallyas described.

3. Asolderingcompound or paste composed of a mixture of Water, borax andfinely-comminuted suboxid of copper, substantially as described.

4. As an article of manufacture, a solder= ing compound, or mixturecontaining copper in a non-metallic state, and a suitable flux,substantially as described.

5. As an article of manufacture, a soldering compound, or mixturecontaining suboxid of copper and borax combined, substantially as setforth and for the purposes described.

6. As an article of manufacture, a soldering compound or mixturecontaining a metal in a non-metallic state capable of being met alizedby heat, which metal in the latter state has great affinity for solder,substantially as described.

Signed at Berlin, Germany, this 10th day of July, 1899.

FRIEDRICH PICH.

